PCB terminals and connectors
Weidmüller is the leading provider for reflow-compatible products. The connection system can be integrated in the SMT process by means of THR or SMD technology. Our broad product spectrum promotes efficiency in the device manufacture in the electronics sector. Manufacturing costs can be reduced through the use of fully automated connection elements in a single manufacturing process. Find out more in the following about our THR and SMD technology.
In the SMT process, the surface-mounted devices (SMDs) are soldered to the PCB with solder pads. The use of SMD components means that it is possible to dispense with wire pins to the components and with the holes normally required for attachment to the PCB.
Electronic subassemblies are manufactured economically using surface-mount technology (SMT) with surface-mount devices (SMD). Design measures, such as co-planarity and the size/shape of the soldering pads, lend electromechanical components a reliable and stable printed-circuit board connection. The design type and temperature stability of Weidmüller SMD components are matched to processing in automated surface mounting equipment. No classical pins are used here, but rather the contact surfaces (angled solder pins) of the PCB connectors and terminal blocks are reflow processed. For this purpose, paste is pressed on the contact surfaces (pads) of the PCB and then the component is assembled on it. While the solder paste melts in the reflow oven, the fluid solder spreads on the solder connection (solder pin and solder pin) as a result of the wetting and capillary forces and forms a perfect adhesive bond.
Subassemblies that are exclusively equipped with SMD components and exposed to medium electromechanical loads.
White paper - Surface Mount Technology (SMT)
Overview SMD PCB terminals
Wave soldered products in THT (Through Hole Technology), also known as pin-in-hole, is the best alternative to SMT (Surface Mount Technology) if higher forces can act on electromagnetic PCB components. The component design of Weidmüller products is specifically developed for this application and takes into account the requirements in terms of design types and processing from the beginning.
Wired (THT) PCB plug-in connectors and terminal blocks are processed in wave soldering. The pins of the component are pushed into the through-holes and are then run through one or more solder waves. When applying the solder to the solder pin, the fluid solder is drawn into the through-holes by the wetting and capillary forces and forms the solder joint.
Wave soldering methodRecommendation wave soldering profile: PDF file
In the through-hole reflow process (THR), components are inserted through a hole in the PCB and then soldered to other SMT components. The special challenge of this method is that the components need to withstand the high temperatures of the SMT process.
Our components (THR and SMT) are made of glass fibre reinforced LCP (Liquid Crystal Polymer). This guarantees a high level of shape stability. The positive temperature properties of the material and the in-built free pitch space make it ideally suited for the solder paste process and also for "lead-free soldering". Wired (THT) PCB plug-in connectors and terminal blocks are processed in reflow. For this purpose, paste is pressed into the through-holes and then the component is pushed through. While the solder paste melts in the reflow oven, the fluid solder is drawn back into the through-hole as a result of the wetting and capillary forces and forms the solder joint.
Reflow soldering methodRecommended reflow soldering profile: PDF file
Wire connection technologies – From crimp connection to clamping yoke connection
Materials and surfaces – Metals used by Weidmüller
White paper – Trends and technologies in device connectivity
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