Technologies and Processing
The basis for high quality, reliability and efficiency is competence in technology. For instance: the Through-Hole-Reflow-Process.
For this soldering process, components are positioned on the PCB via drilled holes and then simultaneously soldered with other surface-mounted components in one reflow process. The THR components are therefore designed to withstand the high temperatures of the SMT-process.
THR Components at SMT-Process
SMT as a standard The PCB component mounting process has progressed from Pin-in-Hole or Through-Hole-Technology (THT) to the faster and more flexible Surface Mount Technology (SMT). Today SMT is THE standard PCB assembly process.