Surface Mount Technology
Efficient integration of device connectivity in the SMT process
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Increasing requirements such as the demand for miniaturisation, higher functional densities of modules and cost-effective manufacturing processes have led to changes to PCB assembly processes. SMT (surface-mount technology) is thus increasingly used in practice instead of the conventional through-hole technology (THT). The SMT process has now established itself as the accepted standard in the manufacture of electronic components.
The connection system can be integrated in the SMT process in two ways: by means of THR (through-hole reflow) or SMD (surface-mount device) technology. A combination of the two approaches is also possible.
In the through-hole reflow process (THR), components are inserted through a hole in the PCB and then soldered to other SMT components. The special challenge of this method is that the components need to withstand the high temperatures of the SMT process.
In the SMT process, the surface-mounted devices (SMDs) are soldered to the PCB with solder pads. The use of SMD components means that it is possible to dispense with wire pins to the components and with the holes normally required for attachment to the PCB.