OMNIMATE Signal – LSF-SMD 3.5/180

SMT – now also without through hole pins for PCB-Mounting: The PCB terminal LSF-SMD meets the demands for fully automatic PCB assembling as a surface-mounting device (SMD). Equipped with the PUSH IN connection technology, now the existing portfolio of Weidmüller‘s reflow compatible LSF-SMT terminals with THR soldering will be expanded with a real SMD variant. It is now possible for applications on glass based, ceramic based and aluminium compound based PCBs to also take advantage of PUSH IN connection technology. The 3.5 mm pitch and the wire outlet direction of 180° allow a high packing density with a maximum wire cross section of 1.5 mm².

Features:

The LCP causes no formation of blisters and no pre-drying is required. Direct assembly with the SMT process is possible.

Safe contact connections up to 1.5 mm² with no tools needed: made possible by the proven PUSH IN connection system. The integrated release button can disconnect the cable in a simple and quick manner.

An efficient automatic assembly process is supported by the tape on reel packaging in standard tape widths. The optimised pick and place pads ensure that the pick and place process is safe and reliable.

With two solder pins per pole, the LSF-SMD PCB terminal is adequately attached to the circuit board and does not need an additional mounting flange.

Product catalogue

Sample set