Technologies and Processing

THR-Technology

For this soldering process, components are positioned on the PCB via drilled holes and then simultaneously soldered with other surface-mounted components in one reflow process. The THR components are therefore designed to withstand the high temperatures of the SMT-process.

THR Components at SMT-Process

SMT as a standard The PCB component mounting process has progressed from Pin-in-Hole or Through-Hole-Technology (THT) to the faster and more flexible Surface Mount Technology (SMT). Today SMT is THE standard PCB assembly process.

Practical THR recommendations

The volume of paste and hence the degree of filling of the solder paste in the paste printing method is critical for optimum soldering results in the SMT process.